Brown
Advanced Electronic Packaging 2e
Gebonden Engels 2006 2e druk 9780471466093Verwachte levertijd ongeveer 9 werkdagen
Samenvatting
As in the
First Edition, each chapter in this new
Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the
First Edition, which became an industry standard and a popular graduate–level textbook, have been retained.
An Instructor′s Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Specificaties
ISBN13:9780471466093
Taal:Engels
Bindwijze:gebonden
Aantal pagina's:848
Uitgever:John Wiley & Sons
Druk:2
Lezersrecensies
Wees de eerste die een lezersrecensie schrijft!
Inhoudsopgave
Chapter 1: Introduction and overview of microelectronic packaging.
<p>Chapter 2: Materials for microelectronic packaging.</p>
<p>Chapter 3: Processing technologies.</p>
<p>Chapter 4: Organic printed circuit board materials and processes.</p>
<p>Chapter 5: Ceramic substrates.</p>
<p>Chapter 6: Electrical considerations, modeling, and simulation.</p>
<p>Chapter 7: Thermal considerations.</p>
<p>Chapter 8: Mechanical design considerations.</p>
<p>Chapter 9: Discrete and embedded passive devices.</p>
<p>Chapter 10: Electronic package assembly.</p>
<p>Chapter 11: Design considerations.</p>
<p>Chapter 12: Radio frequency and microwave packaging.</p>
<p>Chapter 13: Power electronics packaging.</p>
<p>Chapter 14: Multichip and three–dimensional packaging.</p>
<p>Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study.</p>
<p>Chapter 16: Reliability considerations.</p>
<p>Chapter 17: Cost evaluation and analysis.</p>
<p>Chapter 18: Analytical techniques for materials characterization.</p>
<p>Chapter 2: Materials for microelectronic packaging.</p>
<p>Chapter 3: Processing technologies.</p>
<p>Chapter 4: Organic printed circuit board materials and processes.</p>
<p>Chapter 5: Ceramic substrates.</p>
<p>Chapter 6: Electrical considerations, modeling, and simulation.</p>
<p>Chapter 7: Thermal considerations.</p>
<p>Chapter 8: Mechanical design considerations.</p>
<p>Chapter 9: Discrete and embedded passive devices.</p>
<p>Chapter 10: Electronic package assembly.</p>
<p>Chapter 11: Design considerations.</p>
<p>Chapter 12: Radio frequency and microwave packaging.</p>
<p>Chapter 13: Power electronics packaging.</p>
<p>Chapter 14: Multichip and three–dimensional packaging.</p>
<p>Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study.</p>
<p>Chapter 16: Reliability considerations.</p>
<p>Chapter 17: Cost evaluation and analysis.</p>
<p>Chapter 18: Analytical techniques for materials characterization.</p>
Rubrieken
- advisering
- algemeen management
- coaching en trainen
- communicatie en media
- economie
- financieel management
- inkoop en logistiek
- internet en social media
- it-management / ict
- juridisch
- leiderschap
- marketing
- mens en maatschappij
- non-profit
- ondernemen
- organisatiekunde
- personal finance
- personeelsmanagement
- persoonlijke effectiviteit
- projectmanagement
- psychologie
- reclame en verkoop
- strategisch management
- verandermanagement
- werk en loopbaan